High-Conductivity Liquid Metal Thermal Pad – 40×40 Mm Cpu Interface Solution

Description

This liquid metal thermal pad features high thermal conductivity and excellent heat transfer. In addition, it has been insulated against electric conduction of liquid metals to ensure long-term operational safety and stability of CPUs

This High-Conductivity Liquid Metal Thermal Pad – 40×40 Mm Cpu Interface Solution is a curated choice in our TIM Attributes line, providing both quality and value.

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