Description
The Coollaboratory Liquid MetalPad Thermal Interface Pad is the first heat conduction pad composed of 100% metal and melts with heat from the processor (Burn In-process), and then it performs superior heat transfer. It dissipates the heat fast and efficiently, outperforming the best heat conduction pastes. The simple, clean and fast installation turns the Liquid MetalPad into the ultimate heat conduction medium for High End PCs.
The Liquid MetalPad can be used with all on the cooling market commercially available materials, for instance aluminum or copper! It doesn´t age and doesn´t have to be exchanged regularly. The Coollaboratory Liquid MetalPad is RoHS compatible and absolute nontoxic.
The Coollaboratory Liquid MetalPad is delivered in a transparent blister-package and contains three Liquid MetalPads. Additionally there is a detailed printed manual included and a cleaning set for removal / cleaning of the contact area before and after using the Liquid MetalPad.
*Note: This Item can not be shipped using DHL*
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