Description
The Feser Company (TFC) is one of the specialists among the manufacturers of water cooling and is expanding its offerings in this area. In the wake of this development is a separate thermal compound in the name of H-Bridge.
The layer between the cooler and the heat source should never be forgotten. Both surfaces look flat , but microscopic valleys are always present and thus never 100% contact is impossible to achieve. A thermal compound fills gaps and allows a transfer of heat over the entire surface.
With a thermal conductivity of 9.24 W / m ° C is a remarkable performer. The thermal paste is suitable for all types of coolers suitable: CPU, GPU, Chipset, voltage transformers, etc. The compound is suitable over a temperature range of -30 to +200 ° C guaranteed. With 5g, the amount per tube is plenty for many applications.
*Note: This Item can not be shipped using DHL*
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